SiP Flash-(MCP/eMCP/eMMC)

Payton has advanced die stack technology： 8D is running mass production and 16D has finished the 1st sample, mass production is under developing. SiP package design and production are available in Payton.

Products Matrix

Type	Package	Lead NO	Die Stack
MCP	10.5*13	137	2D, 3D
	11.5*13	162	2D, 3D
eMCP	11.5*13	162	2D, 3D, 4D
	11.5*13	221	2D, 3D, 4D, 5D
eMMC	11.5*13	153	1D, 2D, 4D, 8D
	12*16	169	1D, 2D, 4D, 8D

Package:    FBGA –MCP/eMCP/eMMC
Ball Size :  0.45mm/0.3mm
Ball Pitch:   0.8mm /0.5mm
Thickness:      1.0 mm(Max) or 1.2mm(Max)
Die Thickness:     50um~200um

 

                                                                   Package Structure

                                                          Finished goods