Payton engineering team successfully finished 8X die stack of SSDproducts on current equipment. Before 8D of SSD has been approved; 2D and 4D haddone mass production with a stable yield.
Forpresent products, density of single package is up to 128GB, will upgrade to256GB with 3D NAND. Total package thickness is down to 1.2mm with 8D package. Assemblyyield of 8D is over 99.95%, testing yield of 8D product is more than 98.5%.